MS00100 - SEMI MS1 - Guide to Specifying Wafer-Wafer Bonding Alignment Targets Revision:SEMI MS1-0307 (Reapproved 0318) - Superseded

MS00100 - SEMI MS1 - Guide to Specifying Wafer-Wafer Bonding Alignment Targets Revision:SEMI MS1-0307 (Reapproved 0318) - Superseded1 Purpose 1. 1 This Guide provides a framework for specifying the dimensions, location, quantity and characteristics of alignment targets that are placed on each wafer of a pair of wafers. Such targets are used to align two patterned wafers prior to an operation that bonds them together. 2 Scope 2. 1 This Guide applies to targets that can be used with two common alignment processesinner surface alignment and outer surface alignment. 2. 2 This Guide

SEMI G4-89 (technical revision)

これらの方法は，薬品とFPD製造で実際に使用されている条件を用いてカラーフィルタの耐薬品性を試験するものである。

SEMI 3D17-1217 (first published)

SEMI E80-0423 (technical revision)

システム中にあるマテリアルについてその所在位置およびその搬送履歴を記録し報告する。

This Standard covers the domain of semiconductor manufacturing equipment operation

and cost-effectiveness as key elements of successfully installing semiconductor processing equipment into wafer fabrication facilities

The formats for data produced as a result of executing a data collection plan are also defined

It should be noted that the following list of criteria was considered when determining the specified analytical method

except that it uses special wafer holding fixtures to orient the wafer uniquely with respect to the X-ray goniometer

orgで入手可能になり，2004年11月発行に至る。初版は1990年。

The purpose of this document is to provide a specification for dichlorosilane (SiH2Cl2) used in the semiconductor industry