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G02300 - SEMI G23 - 半導体パッケージの内部導体路のインダクタンスのための試験方法 StdPbc-0924 originally published in 1992
G02300 - SEMI G23 - 半導体パッケージの内部導体路のインダクタンスのための試験方法 StdPbc-0924 originally published in 1992
$115.50
Description
originally published in 1992
3D contrast ratio
Structural defects formed in the bulk of a silicon wafer during its growth or induced by electronic device processing can affect the performance of the circuitry fabricated on that wafer
10-0600 (Reapproved 0124)
SEMI E10-0701 (technical revision)
G02300 - SEMI G23 - 半導体パッケージの内部導体路のインダクタンスのための試験方法 StdPbc-0924 originally published in 1992global Assembly & Packaging Technical Committee201171global Audits and Reviews Subcommittee20118www. semiviews. org www. semi. org198019969 Referenced SEMI Standards None.
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