S00900 - SEMI S9 - Guide to Electrical Design Verification Tests for Semiconductor Manufacturing Equipment that have Been Moved to SEMI S22 Revision:SEMI S9-0307 (Withdrawn 0211) - Withdrawn SEMI E134-0813 (technical revision)

SEMI E134-0813 (technical revision)

Its value is dependent on the work function difference between the silicon and the metal field plate

CMP criteria can be determined by metrology technology in both contact methods such as: micro profilometer

but it is recommended that the tests be repeated on an annual basis or whenever the instrument appears to be out of control

This Standard provides a common basis for communication between manufacturers and users regarding testing and describing MFC mounting effects

S00900 - SEMI S9 - Guide to Electrical Design Verification Tests for Semiconductor Manufacturing Equipment that have Been Moved to SEMI S22 Revision:SEMI S9-0307 (Withdrawn 0211) - Withdrawn SEMI E134-0813 (technical revision)The purpose of this document is to provide a permanent withdrawal notice for SEMI S9 indicating that all technical content has been incorporated within SEMI S22. Referenced SEMI Standards SEMI S1 Safety Guideline for Equipment Safety Labels SEMI S2 Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment SEMI S22 Safety Guideline for the Electrical Design of Semiconductor Manufacturing Equipment